A New Procedure for Electroless Tin Plating of Copper

All Akbar Mottahedi*

Iranian Research Organization for Science and Technology (IROST) Arkar Centre, Ghoddosi Blovard, Arak P. O Box: 35135 Arak (Iran)

DOI : http://dx.doi.org/10.13005/msri/020103

ABSTRACT:

An aqueous salt composition belt and method for immersion plating gave increased deposition rates and thicker coatings of better adhesion. It was accomplished by incoportaing into immersion plating tin bath of SnCl2, 2H2O in the amount of 23g per litre and cyanide ion complexing agent for the copper, such as NaCN in the amount of 19.6 g per litre. The bath solution containts NaHCO3 as an agent for adusting the pH in ghe resulting bath in the amount of 10g per litre.

KEYWORDS: Aqueous salt composition bath; immersion plating; Cyanide ion complexing agent

Copy the following to cite this article: Mottahedi A. A. A New Procedure for Electroless Tin Plating of Copper. Mat.Sci.Res.India;2(1)

Copy the following to cite this URL: Mottahedi A. A. A New Procedure for Electroless Tin Plating of Copper. Mat.Sci.Res.India;2(1). Available from: http://www.materialsciencejournal.org/?p=3150

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